Slot die technology is a previously established process in the coating of films for the packaging industry. The transfer of slot die technology in the form of a ring to the textile and apparel industry enables the coating of filaments, yarns and twisted yarns in a vertical structure, and ensures a uniform coating of electrically conductive layers or even color-changing layers.

Sputtering is a well-known technology in the field of mechanics, optics and electrical engineering, especially in the semiconductor industry. The Hochschule Niederrhein uses this technology for filament and tape coatings with silver. The use of a hollow cylinder as magnetron and cathode configuration enables the coating of three-dimensional substrates, since the sputtered particles come from all sides.

Compared to other thin film processes, sputter deposition has several advantages, for example, dry sputtering is more environmentally friendly compared to typical chemical processes because no solvents are used and no wastewater is generated. In addition, almost any material can be sputtered, whether conductive or non-conductive (using an RF diode).

At The Hochschule Niederrhein, this machine is used to apply thin for the development of electronic components, e.g. transistors, on filaments.

For functional sewing materials, such as electrically conductive thread or electroluminescent wires, the conventional "standard industrial sewing machines" are not adequate to cope with the material and the subsequent application. A machine with a laying thread device is ideal. In this way, the functional threads can be used as a guide thread and are not subject to mechanical stresses during the seam formation process.

The Dutch company Habraken has developed a machine that can produce continuous seams in 3D. The machine, designated HM 835, is based on a twin-needle post bed machine of the M-Type series from Dürkopp Adler, type 867.

On the hardware side, the machine has a rotating needle bar as well as two thread feeders and a special control and programming unit. Functional materials can thus be laid and experience no abrasion or mechanical stress.

The multifunctional embroidery machine type SGVA of the company ZSK Stickmaschinen GmbH is a special machine, which has three different technical embroidery heads for different embroidery processes.

The F-head is a standard embroidery head with nine needles. This head has the technique of double-lock stitch embroidery and additionally enables embroidery applications such as sequin appliqué, drill embroidery, double-roll cord embroidery, as well as loop, cap and ribbon embroidery.

The K-head embroidery processes, the moss stitch and chain stitch, are single-thread systems. Here, the embroidery base is penetrated with a hook needle and the thread material fed from below is conveyed in a loop through the embroidery base to the upper side.

The W-head embroidery process is based on a three-thread system with upper and lower threads and a laying medium. The laying process is subdivided into three main technologies: Tailored Fibre Placement (TFP), Tailored Wire Placement (TWP) and Tailored Tube Placement (TTP).

Knitting technology offers a wide range of design options for processing electrically conductive yarns in several layers of a knitted fabric, so that resistive and capacitive textile sensors can be realized in the knitted fabric by combining them with hygroscopic materials or semiconductor coatings.

3D printing is a generative and additive manufacturing process that can produce models, samples, prototypes, tools and final products, quickly and cheaply. Generative manufacturing is based on the foundation course of 3D CAD models, "Digital Fabrication". The principle of 3D printing is based on building virtually any shape in layers, which is why the 3D printing process is also known as additive manufacturing.

3D printing enables printing with a wide variety of materials. These include plastics for the familiar extrusion printing process in numerous colors, with cellulosic or mineral content, as well as flexible thermoplastic polyurethanes, conductive plastics with metallic content and water-soluble polymers. In addition, many other interesting materials can be processed for experimental 3D printing, such as sugar, salt, concrete, graphene or chocolate.

A novel and special 3D printing technologies is used to print multilayer circuits, apply pastes and place components on the board.

This 3D printing technology enables the printing of conductive and insulating inks for a multilayer circuit board structure. Conductive adhesive is applied using a dispenser. An integrated pick and place pushbutton detects presented electronic components, activates applied conductive adhesive by means of integrated UV lamps and places the components on the previously printed PCB. In this way, individual and flexible PCBs can be produced.